Bopp low adhesion tape is used as the basement film for die cutting, protecting and waste disposal.
Backed by Jiangsu Gelly Adhesive Material Technology Co., Ltd and our 30 years of adhesive expertise, our BOPP Low Adhesion Tape (also known as process tape, base film, or matrix removal tape) is an essential auxiliary material for the die-cutting, label printing, and electronics manufacturing industries. Featuring a high-tensile BOPP film backing coated with a specialized low-tack adhesive (or release coating), this tape provides a stable, ultra-low peel force. It is specifically engineered to act as a base film for die-cutting, a carrier for waste matrix stripping, and a temporary surface protection layer, ensuring smooth processing without leaving any sticky residue on delicate substrates.
Stable Ultra-Low Adhesion: Provides a consistently low and stable peel force (typically 0.5 - 3.0 N/25mm), allowing for effortless removal from various substrates (paper, film, metal, glass) without tearing the underlying material.
High Tensile Strength for Matrix Removal: The premium BOPP film backing offers exceptional tensile strength and puncture resistance, preventing the tape from snapping or stretching during high-speed waste matrix stripping and automated die-cutting processes.
Zero Residue & Clean Removal: The specialized low-tack formulation ensures that the tape peels off cleanly in one piece, leaving absolutely no adhesive transfer or ghosting on the protected surfaces or die-cutting plates.
Excellent Dimensional Stability: Maintains its flatness and structural integrity under varying temperatures and humidity levels, preventing curling or edge-lifting during precision slitting and lamination processes.
Smooth Unwinding: Treated for consistent, quiet, and smooth unwinding from jumbo rolls, optimizing the efficiency of automatic dispensing and laminating machines.
Die-Cutting Base Film: Used as a carrier or base film to transport delicate die-cut parts (such as foam, gaskets, and adhesive films) through the converting process without sticking to the machinery.
Label Matrix Removal (Waste Stripping): Ideal for lifting and removing the waste matrix (the skeletal web of label stock) after die-cutting, ensuring high-speed production lines run without web breaks.
Electronics & FPC Manufacturing: Serves as a temporary holding and protection tape for Flexible Printed Circuits (FPC), PCBs, and delicate optical films during assembly, testing, and transit.
Surface Protection & Lamination: Protects highly polished surfaces, acrylic panels, and coated metals from scratches and dust during processing, while allowing for easy, residue-free peeling before final packaging.
Construction: Premium BOPP Film + Low-Tack Acrylic Adhesive / Silicone Release Coating
| Item | Specification / Data | Customization |
| Backing Material | BOPP (Biaxially Oriented Polypropylene) Film | PET available upon request |
| Adhesive / Coating Type | Low-Tack Acrylic / Silicone Release | Custom peel force adjustable |
| Total Thickness | 30 μm / 40 μm / 50 μm / 60 μm | Custom thickness acceptable |
| 180° Peel Adhesion | 0.5 - 3.0 N/25mm (Ultra-Low) | Tailored to substrate |
| Tensile Strength | ≥ 90 N/25mm (High strength for matrix removal) | / |
| Elongation at Break | ≤ 120% | / |
| Temperature Resistance | 60°C - 80°C | High-temp series available |
| Standard Color | Transparent / Clear / Milky White | Custom colors acceptable |
| Standard Jumbo Widths | 1280mm (usable 1260mm) / 1020mm (usable 1000mm) / 980mm / 960mm |
| Standard Jumbo Length | 2000m / 4000m per roll |
| Slit Roll Widths | Custom precision slitting from 5mm to 1260mm based on customer requirements. |
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No. Our BOPP Low Adhesion Tape is manufactured with a high-tensile strength backing specifically designed for converting processes. It offers exceptional puncture resistance and dimensional stability, ensuring the web remains intact and does not snap during high-speed automated matrix stripping operations.
Absolutely. Different substrates (e.g., raw silicone, acrylic adhesives, delicate optical films) require different release forces. Our R&D team can precisely adjust the low-tack adhesive formulation to achieve your exact required peel force (typically between 0.5 and 3.0 N/25mm), ensuring smooth release without lifting the die-cut parts.
Yes. Because of its ultra-low adhesion and zero-residue formulation, it is widely used as a temporary process film to protect highly polished metals, acrylic panels, and coated surfaces from scratches and dust during CNC machining, bending, and transit. It peels off cleanly without leaving any ghosting or adhesive transfer.
We supply both. We offer standard jumbo rolls (e.g., 1280mm x 4000m) for tape converters and laminators. Additionally, we utilize 6 sets of high-speed precision slitting machines to provide custom slit widths (from 5mm up to 1260mm) with extremely tight tolerances, ready for direct use on your die-cutting and label presses.
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